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PCB Reflow Process: Profile Control, Defects and Inspection Checks
Understand the complete PCB reflow process from solder paste and placement through measured thermal profiling, oven zones, defect analysis, inspection and release.
Understand the complete PCB reflow process from solder paste and placement through measured thermal profiling, oven zones, defect analysis, inspection and release.
Compare reflow, wave, selective and hand PCB soldering processes, their key controls, common defects and inspection evidence.
Follow PCB SMT assembly from file and material control through paste printing, SPI, placement, reflow, AOI, X-ray and electrical test.
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