A component does not simply release heat into open air. Heat must travel from the semiconductor junction or resistive element through the package, solder connection, PCB copper, vias, thermal interface, enclosure, heat sink, or surrounding air. PCB layout determines how continuous—or restrictive—that path becomes. Two boards using the same component Read more
High power components rarely fail because the schematic is wrong. More often, they fail because the heat has nowhere to go. Power MOSFETs, LED drivers, DC-DC converters, motor driver ICs, GaN devices, voltage regulators, and high-current QFN packages can all generate concentrated heat in a very small area. If that Read more
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