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PCB Gold Plating Process: ENIG vs Hard Gold Steps and Controls
See how ENIG and electrolytic hard gold PCB processes differ, from pretreatment and nickel deposition to gold plating, inspection and RFQ controls.
See how ENIG and electrolytic hard gold PCB processes differ, from pretreatment and nickel deposition to gold plating, inspection and RFQ controls.
Every bare copper pad on a PCB starts oxidizing the moment it is exposed to air. A surface finish is the layer that sits between that copper and the outside world. It keeps the copper solderable during storage and assembly, and it defines the metallurgy of every solder joint on Read more
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